Semiconductor device having compliant columnar electrical connec

Details Semiconductor device having compliant columnar electrical connec Semiconductor device having compliant columnar electrical connec

1994-07-05

1995-11-21

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257778, H01L 2350

Patent

active

054689953

ABSTRACT:
An array type semiconductor device (10 and 40) has compliant polymer columnar I/O connections (30) to accommodate thermally induced stress during device operation. The device has a semiconductor die (22) mounted to a substrate (12) and electrically connected thereto. A package body (28, 46) covers the semiconductor die and electrical connections (26, 42) to provide mechanical protection. The I/O contacts are formed from a polymer core (34) that is metallized to impart electrical conductivity to the contacts. The metallization (36, 38) may either be a plating around the polymer core or fillers embedded in the polymer. The aspect ratio of the polymer contacts is greater than one to provide compliance while maintaining high I/O density in the array. The metallized polymer contacts may be attached to the package substrate and to a PWB with joints (32) composed of either solder or a conductive adhesive.

REFERENCES:
patent: 4807021 (1989-02-01), Okumura
patent: 5067007 (1991-11-01), Kanji et al.
patent: 5235741 (1993-08-01), Mase
patent: 5237635 (1993-08-01), Lai
IBM Technical Disclosure Bulletin; "Pressure Contact Type Chip Join Technique," Ward, vol. 18, No. 9, Feb. 1976.

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