Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1992-08-21
1993-11-09
Bradley, Paula A.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 70, 439 73, 439331, 439525, 439526, H01R 909
Patent
active
052597717
ABSTRACT:
A chip carrier socket assembly (10) for electrical connecting leads (81) on a chip carrier (80) to a board on which the socket is seated, comprises a base (20) having a chip carrier receiving opening (22) in relation to peripheral walls (24) thereof. A plurality of lower contacts (70) are disposed in the base (20) for electrical connecting to the respective printed circuit board pads. The socket (10) further includes a cover (40) complementarily positioned on the base (20). The cover (40) has therethrough a central opening corresponding to the opening (22) of the base (20) and surrounded by circumferential walls (44). A corresponding plurality of upper contacts (60) are disposed in the cover (40) for mechanically pressing against and electrically connecting to the leads (81) of the chip carrier (80). The chip carrier (80) can be retained within the cover (40) by means of the upper contacts (60) thereof without regard to the base (20). The upper contacts may connected to the lower contacts so that no other additional securing means are required to lock the cover and the base together.
REFERENCES:
patent: 3656183 (1972-04-01), Walterscheid
patent: 4688870 (1987-08-01), Egawa et al.
patent: 5154620 (1992-10-01), Martucci et al.
Bradley Paula A.
Foxconn International, Inc.
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