Low inductance surface-mount connectors for interconnecting circ

Details Low inductance surface-mount connectors for interconnecting circ Low inductance surface-mount connectors for interconnecting circ

1994-09-08

1996-12-31

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

H01R 909

Patent

active

055888488

ABSTRACT:
In accordance with the invention, a low inductance surface-mount connector comprises a slotted, hollow rectangular parallelepiped. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of compactness, low inductance, and mechanical compliance. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.

REFERENCES:
patent: 4605278 (1986-08-01), Seidler
patent: 4915652 (1990-04-01), Madara
patent: 5256086 (1993-10-01), Pom
F. W. Grover, Inductance Calculations: Working Formulas And Tables, Van Nostrand (1946).

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