Semiconductor chip die bonding using a double-sided adhesive tap

Details Semiconductor chip die bonding using a double-sided adhesive tap Semiconductor chip die bonding using a double-sided adhesive tap

1994-03-28

1995-05-02

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437215, 437219, 437220, H01L 2160

Patent

active

054119219

ABSTRACT:
A semiconductor wafer is stuck on an expandable tape via a double-sided adhesive tape, and the semiconductor wafer is diced into semiconductor chips such that the double-sided adhesive tape is also cut into tape sections. Then, the expandable tape is expanded to deform plastically to thereby part the semiconductor chips from each other. Then, the semiconductor chip and the tape section stuck thereto is removed from the expandable tape, in which the semiconductor chip is pushed by a bar having a pointed tip while the expandable tape is vacuum-sucked. Finally, the semiconductor chip is bonded to a die pad of a lead frame via the tape section stuck to the semiconductor chip.

REFERENCES:
patent: 3887996 (1975-06-01), Hartleroad et al.
patent: 4590667 (1986-05-01), Simon
patent: 4667402 (1987-05-01), Wilde
patent: 5110388 (1952-05-01), Komiyama et al.
patent: 5270260 (1993-12-01), Scheunenpflug

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