Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1976-03-15
1978-06-20
Grimley, Arthur T.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
228110, 29589, H05K 502, H05K 102
Patent
active
040963489
ABSTRACT:
A semiconductor integrated circuit device of the beam lead type having a semiconductor interconnection substrate with apertures for integrated circuit chips therein and with metallization patterns having sharply pointed ends for penetrating oxide layers over the bonding pads of the chips and for making electrical connection thereto. Devices thus produced may be assembled and tested and failed chips replaced as necessary before the chips are ultrasonically welded to the interconnection metallization and before final fabrication of the device. The invention also includes a method for producing an interconnection substrate in which a plurality of conically shaped holes are etched into a semiconductor wafer having sharp points within the body of the wafer. A metal layer is deposited over the surface of the semiconductor wafer filling the etched holes. Sharp points are thus formed on the metal in the etched holes. Apertures are then etched in the semiconductor wafer and the metal layer etched as required to provide sharply pointed connecting probes suspended above apertures in the semiconductor wafer.
REFERENCES:
patent: 3436604 (1969-04-01), Hyltin et al.
patent: 3480836 (1969-11-01), Aronstein
patent: 3484534 (1969-12-01), Kilby et al.
patent: 3698075 (1972-10-01), Boyle
patent: 3709424 (1973-01-01), Drees
Michals Robert L.
Robillard David R.
Bartlett M. D.
Grimley Arthur T.
Inge J. R.
Pannone J. D.
Raytheon Company
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