Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Patent
1997-05-23
1999-08-10
Chang, Joni
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
438 29, 350290, 350291, 350310, 350315, 350316, H01L 2100
Patent
active
059372710
ABSTRACT:
An inventive method for manufacturing an array of M.times.N thin film actuated mirrors for use in an optical projection system includes the step of: providing a substrate; depositing a thin film sacrificial layer on top of the substrate; creating an array of M.times.N empty cavities on the thin film sacrificial layer; depositing an elastic layer; patterning the elastic layer into an array of M.times.N elastic members; forming an array of M.times.N switching device on the substrate; depositing a passivation layer and an etchant stopping layer; removing the etchant stopping layer and the passivation layer, selectively, such that elastic members are exposed; forming an array of M.times.N second thin film electrodes and an array of M.times.N thin film electrodisplacive members, successively, on top of each of elastic members; forming an array of M.times.N actuating structures; and removing the thin film sacrificial layer to thereby form the array of M.times.N thin film actuated mirrors. In order to prevent the thermal damage of the active matrix, in inventive method, an array of M.times.N switching devices are formed on the substrate after all of the high temperature processes are completed, which will, in turn, reduces the possibility of thermal damages occurring on the array of switching devices.
REFERENCES:
patent: 5768006 (1998-06-01), Min et al.
patent: 5859724 (1999-01-01), Nam
Chang Joni
Daewoo Electronics Co., Inc.
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