Method for fabricating conductive epoxy grid array semiconductor

Details Method for fabricating conductive epoxy grid array semiconductor Method for fabricating conductive epoxy grid array semiconductor

1993-09-15

1995-05-02

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

439 91, H05K 334

Patent

active

054108063

ABSTRACT:
A method and system for producing a plurality of semiconductor device assemblies utilizing a grid array of conductive epoxy for connecting to an electronic system. Conductive epoxy is screen printed in a desired pattern onto a printed wire board of the semiconductor device assembly. The conductive epoxy is B-staged by heating in an oven. The semiconductor device assembly is then placed onto a system printed circuit board wherein the B-staged conductive epoxy is further cured by heat and effectively makes mechanical and electrical connections between the semiconductor device assembly and the system printed circuit board.

REFERENCES:
patent: 4729809 (1988-03-01), Dery et al.
Adhesives Age October Oct, 1990, pp. 36-39 by Burkhart et al.
Computers and Electronics, Sep. 1984, PP12(2) by Solomon.
Electronic Engineering Times, Apr. 1992, p. 48, by Bindra.
Machine Design, May 1986, pp. 231-238.

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