Method for manufacturing a single product from integrated circui

Details Method for manufacturing a single product from integrated circui Method for manufacturing a single product from integrated circui

1993-09-14

1995-05-02

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

437209, 437220, H01R 4300

Patent

active

054108047

ABSTRACT:
Encapsulated integrated circuits (chips) (2, 3, 4, 5, 6) are manufactured by separating the encapsulated integrated circuits arranged on a lead frame (1), subsequently cutting away the lead-connecting strips (7) of the individual products, then bending the leads and finally cutting them to length. By subjecting the products individually to the above stated method steps, products in a great variety of dimensions can be processed. The method and device according to the invention are particularly suitable for manufacturing pilot series on laboratory scale.

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Patent Abstracts of Japan, vol. 7, No. 267, (E-213) (1412), 29 Nov. 1983 & JP A 58 151 047 (Nippon Kogyo K.K.), 8 Sep. 1983.

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