Film segment having integrated circuit chip bonded thereto and f

Details Film segment having integrated circuit chip bonded thereto and f Film segment having integrated circuit chip bonded thereto and f

1988-10-05

1990-06-26

Davie, James W.

357 69, H01L 2348

Patent

active

049376551

ABSTRACT:
A film segment has a flexible beam lead frame formed thereon, to which an IC chip is adapted to be bound in a wireless manner. The film segment having a rectangular shape is provided with at least two positioning perforations formed therein, each of which is adapted to receive and fit a positioning pin element, the positioning perforations being located along one of the diagonal lines of said film segment and in the vicinity of said flexible beam lead frame. The fixture is held by a fixture having a window encompassing the positioning perforations. The film segment can be positioned for testing the IC chip at a given test position with respect to the fixture by inserting the positioning pin elements into the positioning perforations through said window.

REFERENCES:
patent: 4007479 (1977-02-01), Kowalski
patent: 4069496 (1978-01-01), Kowalski
patent: 4547794 (1985-10-01), Tang

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