Patent
1988-09-21
1990-06-26
Jackson, Jr., Jerome
357 54, 357 236, H01L 2978, H01L 2702
Patent
active
049376500
ABSTRACT:
A semiconductor device having a large-capacitance capacitor in which an insulator film is formed underneath a film made of a material having a high dielectric constant, such as tantalum oxide, in such a manner that a portion of the insulator film underneath a defect region which is undesirably thin is thicker than other portions of the insulator film, thereby preventing occurrence of a failure in terms of dielectric strength and deterioration of the lifetime of the capacitor which would otherwise be caused by the existence of the defect region. Also disclosed is a process for producing such semiconductor device. Thus, it is possible to effectively prevent occurrence of problems which would otherwise be caused when a material having a high dielectric constant, such as tantalum oxide, is employed as a dielectric film of a capacitor, so that the reliability of a semiconductor having a large-capacitance capacitor is greatly improved.
REFERENCES:
patent: 4495219 (1985-01-01), Kato et al.
patent: 4589056 (1986-05-01), Stimmell
patent: 4636833 (1987-01-01), Nishioka
Mukai Kiichiro
Nishioka Yasushiro
Sakuma Noriyuki
Shinriki Hiroshi
Hitachi , Ltd.
Jackson, Jr. Jerome
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