MPC module with exposed C4 die and removal thermal plate design

Details MPC module with exposed C4 die and removal thermal plate design MPC module with exposed C4 die and removal thermal plate design

1997-11-18

1999-08-10

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 152, 174 163, 361700, 361715, H05H 720

Patent

active

059368381

ABSTRACT:
An electronic assembly which has a ring that creates a dam for a thermal grease. The assembly may include an integrated circuit which is mounted to a substrate. The assembly may also include a cover which has an opening that exposes the integrated circuit. The ring is coupled to the integrated circuit and the cover. A thermal element may be placed adjacent to the integrated circuit and the thermal grease. The dam controls the flow of the thermal grease. The opening allows the thermal element to be placed adjacent to the integrated circuit. In one embodiment the thermal element may be attached to the cover by a hinge. The hinge thermal element may compensate for tolerances in the assembly without creating excessive forces on the integrated circuit.

REFERENCES:
patent: 5424913 (1995-06-01), Swindler

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