Flexible base materials for printed circuits

Details Flexible base materials for printed circuits Flexible base materials for printed circuits

1989-03-27

1990-06-26

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428212, 428457, 428458, 4284735, 428901, 174254, 361397, 361398, B32B 900

Patent

active

049371339

ABSTRACT:
Flexible printed circuit base materials of this invention are composed of at least one layer of polyimide resins of low thermal expansion, at least one layer of polyimide resins of high thermal expansion with a higher linear expansion coefficient than that of the foregoing polyimide resins, and at least one layer of a conductor, highly reliable in dimensional stability to temperature changes, adhesive strength, and flatness after the etching, easy to work with in protection of the circuits made by etching.

REFERENCES:
patent: 4513055 (1985-04-01), Leibowitz
patent: 4526835 (1985-07-01), Takahashi et al.
patent: 4569692 (1986-02-01), Butt
patent: 4772496 (1988-09-01), Maeda et al.

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