Mounting for a semiconductor integrated circuit device

Details Mounting for a semiconductor integrated circuit device Mounting for a semiconductor integrated circuit device

1997-09-09

1999-02-02

Feild, Lynn D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361820, 257433, 257434, 257680, 257681, 438116, 174 522, 174 523, H01L 310203

Patent

active

058673687

ABSTRACT:
A mounting for a semiconductor integrated circuit device, such as a charge coupled device ("CCD") or an erasable programmable read only memory device ("EPROM"), includes an insulating substrate having an aperture between its first and second surfaces. A first surface of the integrated circuit device is placed adjacent to and facing the first surface of the substrate. Light sensitive circuitry on the first surface of the integrated circuit device is aligned with the aperture. Solder bumps on the periphery of the first surface of the integrated circuit are electrically connected to corresponding conductive metallizations on the first surface of the substrate. A aperture cover transparent to light is affixed to the second surface of the substrate and extends over the aperture, so that light may be transmitted through the aperture cover and aperture to the light sensitive circuitry on the first surface of the integrated circuit device. The substrate may be a printed circuit board.

REFERENCES:
patent: 4663652 (1987-05-01), Nishizawa
patent: 4760440 (1988-07-01), Bigler et al.
patent: 5118370 (1992-06-01), Ozawa
patent: 5200631 (1993-04-01), Austin et al.
patent: 5331512 (1994-07-01), Orton
patent: 5357056 (1994-10-01), Nagano
patent: 5478007 (1995-12-01), Marrs
patent: 5495450 (1996-02-01), Zollo et al.
patent: 5753857 (1998-05-01), Choi
patent: 5786589 (1998-07-01), Segawa et al.

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