Semiconductor chip assemblies with face-up mounting and rear-sur

Details Semiconductor chip assemblies with face-up mounting and rear-sur Semiconductor chip assemblies with face-up mounting and rear-sur

1991-09-24

1994-09-13

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257696, H01L 2302, H01L 2312

Patent

active

053471598

ABSTRACT:
A semiconductor chip having contacts on a front face is provided with a flexible, sheet-like backing element overlying the rear face. Terminals on the backing element are connected to the contacts by leads extending alongside the edges of the chip. The backing element desirably is formed integrally with flaps extending from edges of the backing element, and the leads desirably extend along these flaps. The flaps may be bent upwardly so as to bring the leads to the vicinity of the contacts on the chip. Preferably, the backing element and flaps are preassembled to a box-like element with the backing element overlying the bottom of the box and the flaps extending upwardly along the sides of the box so that the extremities of the leads on the flaps are positioned adjacent the top opening of the box for connection to contacts on a chip inserted into the box. A compliant layer most preferably is provided between the terminals on the backing element and the chip.

REFERENCES:
patent: 4189825 (1980-02-01), Robillard et al.
patent: 4751482 (1988-06-01), Fukuta et al.
patent: 4772936 (1988-09-01), Reding et al.
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 4926241 (1990-05-01), Carey
patent: 4954878 (1990-09-01), Fox et al.
patent: 4967261 (1990-10-01), Niki et al.
IBM Technical Disclosure Bulletin entitled "Non-Permanent Mounting Technique for Test and Burn-In of C.sub.4 Devices", Nov. 1990, vol. 33, No. 7.
IBM Technical Disclosure Bulletin, entitled "Extended Pad for Testing Package Parts", Dec. 1984, vol. 27, No. 7B.
IBM Technical Disclosure Bulletin entitled "Test and Repair of Direct Chip Attach Modules", Aug. 1988, vol. 31, No. 3.

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