Curable resin, process for making and electronic part protective

Details Curable resin, process for making and electronic part protective Curable resin, process for making and electronic part protective

1993-01-12

1994-09-13

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

528 28, 528 41, 525431, C08G 7726

Patent

active

053469798

ABSTRACT:
A novel curable polyimide resin of structural formula (1) or (2) is provided wherein R.sup.1 and R.sup.2 are independently substituted or unsubstituted monovalent C.sub.1-10 hydrocarbon groups, R.sup.3 is a divalent C.sub.1-10 organic group, X is a tetravalent organic group containing an aromatic or aliphatic ring, Y is a divalent organic group, Z is a divalent organic group containing an aromatic ring, W is a trivalent organic group containing an aromatic ring, m is an integer of 1 to 3, and n is an integer of at least 1. It can be prepared by reacting a polyimide with a silicon compound. The curable resin forms with a solvent a solution having a low viscosity and shelf stability and cures at relatively low temperatures below 300.degree. C. into coatings having heat resistance, mechanical strength, electrical properties, solvent resistance and substrate adherence. ##STR1##

REFERENCES:
patent: 3288754 (1966-11-01), Green
patent: 4518735 (1985-05-01), Goodrich et al.
patent: 4647630 (1987-03-01), Schmid et al.
patent: 4970283 (1990-11-01), Kunimune et al.

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