Printed circut board with embedded decoupling capacitance and me

Details Printed circut board with embedded decoupling capacitance and me Printed circut board with embedded decoupling capacitance and me

1996-06-12

1998-08-18

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361766, 361807, 361809, 3613011, 3613012, 3613062, 3613063, 439 68, 174 5054, 174250, 174255, 174260, H05K 116

Patent

active

057965870

ABSTRACT:
A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil, and layering the coated foil with a second conductor foil on top of the coating of dielectric material. Also claimed is an electronic circuit package incorporating at least one embedded capacitor manufactured in accordance with the present invention.

REFERENCES:
patent: 4775573 (1988-10-01), Turek
patent: 4792779 (1988-12-01), Pond et al.
patent: 5010641 (1991-04-01), Sisler
patent: 5027253 (1991-06-01), Lauffer et al.
patent: 5079069 (1992-01-01), Howard et al.
patent: 5144526 (1992-09-01), Vu et al.
patent: 5155655 (1992-10-01), Howard et al.
patent: 5161086 (1992-11-01), Howard et al.
patent: 5162977 (1992-11-01), Paurus et al.
patent: 5172304 (1992-12-01), Ozawa et al.
patent: 5261153 (1993-11-01), Lucas
patent: 5428499 (1995-06-01), Szerlip et al.
patent: 5469324 (1995-11-01), Henderson et al.
"Raw Card Composite Capacitor," Olsen, F. W., IBM Technical Disclosure Bulletin, vol. 22, No. 6, Nov. 1979, p. 2261.
"Integrated Power Plane Decoupling," IBM Technical Disclosure Bulletin, vol. 32, No. 4B, Sep. 1989, pp. 414-416.
"Noise Reduction Through Decoupling Techniques in Multi-Layered Printed Circuits," Fitzgerald, F. C. Research Disclosure No. 288, Apr. 1988, Article 28844.

Affiliated with

Also associated with

Rating

Printed circut board with embedded decoupling capacitance and me does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circut board with embedded decoupling capacitance and me, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circut board with embedded decoupling capacitance and me will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1120811