Printed circuit board and heat sink arrangement

Details Printed circuit board and heat sink arrangement Printed circuit board and heat sink arrangement

1996-11-21

1998-08-18

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165185, 174 163, 257712, 257718, 257719, 361719, 361720, H05K 720

Patent

active

057965820

ABSTRACT:
Making an assembly of a printed circuit board structure and heat sink structure by locating a thermally conductive surface release agent upon a side of one of the structures and causing a flowable thermally conductive material to flow through a hole in the heat sink and lie between the release agent and the other structure. The thermally conductive material lies in heat conductive contact with the release agent and with the other structure and in alignment with an electronic component which is to be cooled upon the board. The release agent ensures easy release of the printed circuit board structure from the heat sink structure for disassembly purposes. An assembly of the two structures is also covered.

REFERENCES:
patent: 5646826 (1997-07-01), Katchmar
patent: 5661902 (1997-09-01), Katchmar

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