Process of manufacturing an intergrated circuit having an interf

Details Process of manufacturing an intergrated circuit having an interf Process of manufacturing an intergrated circuit having an interf

1995-05-31

1999-02-02

Graybill, David

Fishing, trapping, and vermin destroying

437228, 148DIG135, 1566361, H01L 2148, H01L 2156, H01L 2158, H01L 21301

Patent

active

058664360

ABSTRACT:
A method of improving the yield and achievable tolerances of integrated circuits by obtaining surface measurements of non-reflective soft mounting films used in integrated circuit manufacture. The non-reflective surface of a mounting film is first rendered reflective by applying a reflective wafer atop the film surface. This reflective test wafer, which is highly plano-parallel and preferably has a thickness less than that of the ultimate product wafer, is applied to the mounting film to be measured via direct pressure whereby the reflective test wafer conforms to and takes on the surface characteristics and contours of the film. The formerly non-reflective surface of the mounting film is thereby rendered effectively reflective and thus susceptible to optical profiling and graphical and numerical recordation by a computerized interferometer in accordance with well-known techniques. The mounting film may then be critically applied during integrated circuit manufacture, during initial wafer forming and/or during chemo-mechanical polishing for layer planarization.

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