Process and device for fabrication of copper-lined laminates

Details Process and device for fabrication of copper-lined laminates Process and device for fabrication of copper-lined laminates

1986-04-24

1987-08-18

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156192, 156233, 156269, 1563077, 156324, 156344, 156536, 1565835, 156584, 204 351, C25D 500

Patent

active

046875280

ABSTRACT:
Copper-lined laminates are formed by galvanically depositing a copper layer on a portion of at least one of two endless press bands arranged to define a reaction zone between two generally parallel sides thereof. After depositing of the copper layer, the press bands are moved through the reaction zone and resin impregnated plastic webs are also moved between the press bands in the reaction zone to form a laminated structure which is then stripped from the press bands to form the copper-lined laminates.

REFERENCES:
patent: 3043728 (1962-07-01), Stauffer
patent: 3660190 (1972-05-01), Stroszynski
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 4176035 (1979-11-01), Pedone
patent: 4579612 (1986-04-01), Held
patent: 4587166 (1986-05-01), Garrison
patent: 4599128 (1986-07-01), Held

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