Semiconductor chip module

Details Semiconductor chip module Semiconductor chip module

Filed on

1992-07-06

Date issued

1995-02-07

Examiner

Hille, Rolf

Patent Class

Active solid-state devices (e.g., transistors, solid-state diode

SubClass

Housing or package

SubSubClass

Insulating material

Other Related Categories

257713, 257719, 257722, H01L 2302

Type

Patent

Status

active

Patent number

053878159

Description

ABSTRACT:
The semiconductor chip module comprises a substrate on which a wiring portion is formed, a semiconductor chip mounted so as to face a circuit side down to the wiring portion, a heat sink with one end in contact with a side opposite to the circuit side of the semiconductor chip, and a cap enclosing the semiconductor chip and having an opening exposing externally the other end of the heat sink. A metal film is formed at least on the inner wall of the opening and on the surface of the heat sink which is inserted into the cap. An adhesive material is filled between the tip portion of the heat sink and the semiconductor chip, while an adhesive material is filled between the metal films.

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Patent Abstracts of Japan, vol. 015, No. 254 (E-1083), Jun. 1991, JP-A-03 082 144 (Hitachi Ltd.), Apr. 8, 1991.
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Cavaliere et al., High-Performance Single-Chip Module, IBM Technical Disclosure Bulletin, vol. 24, No. 1A, Jun. 1981, New York, pp. 46-48.

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