Method for forming molded ceramic devices having embedded spiral

Details Method for forming molded ceramic devices having embedded spiral Method for forming molded ceramic devices having embedded spiral

1997-01-02

1998-08-18

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 8916, 156 8917, 156155, 264681, B32B 3126

Patent

active

057954224

ABSTRACT:
A method of fabricating a molded ceramic device having an embedded spiral coil, is disclosed which includes: forming grooves that provide portions of a spiral coil in surfaces of first and second ceramic plates; aligning the grooves in the first and second ceramic plates and sintering the first and second ceramic plates to form a unitary structure; and filling the aligned grooves with sacrificial material. The method further includes removing the sacrificial material from the unitary structure; and filling the grooves with a conductive material to complete a conductive spiral coil.

REFERENCES:
patent: 5312674 (1994-05-01), Haertling et al.
patent: 5683649 (1997-11-01), Chatterjee et al.

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