Polishing pad with elongated microcolumns

Details Polishing pad with elongated microcolumns Polishing pad with elongated microcolumns

1996-09-30

1998-08-18

Rose, Robert A.

Abrading

Flexible-member tool, per se

451921, 451533, 451536, 451538, B24D 1100

Patent

active

057952183

ABSTRACT:
A polishing pad for use in chemical-mechanical planarization (CMP) of semiconductor wafers includes a multiplicity of elongated microcolumns embedded in a matrix material body. The elongated microcolumns are oriented parallel to each other and extend from a planarizing surface used to planarize the semiconductor wafers. The elongated microcolumns are uniformly distributed throughout the polishing pad in order to impart uniform properties throughout the polishing pad. The polishing pad can also include elongated pores either coaxial width or interspersed between the elongated microcolumns to provide uniform porosity throughout the polishing pad.

REFERENCES:
patent: 4055029 (1977-10-01), Kalbow
patent: 5020283 (1991-06-01), Tuttle
patent: 5177908 (1993-01-01), Tuttle
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5297364 (1994-03-01), Tuttle
patent: 5329734 (1994-07-01), Yu
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5533923 (1996-07-01), Shamouilian et al.
patent: 5584146 (1996-12-01), Shamouilian et al.
patent: 5645469 (1997-07-01), Burke et al.

Affiliated with

Also associated with

Rating

Polishing pad with elongated microcolumns does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing pad with elongated microcolumns, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing pad with elongated microcolumns will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1110153