Manufacturing integrated circuit cards

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156293, 264145, 264157, 26427213, 26427214, 26427215, 26427217, B29C 4514, B29C 6902

Patent

active

053873068

ABSTRACT:
An integrated circuit card is manufactured by reaction injection moulding around the insert bearing the electronic components, and between high tensile skins which form opposed surfaces of the card. Apparatus is disclosed for the continuous manufacture of the cards between a pair of moving belts.

REFERENCES:
patent: 2166643 (1939-07-01), Salfisberg
patent: 4240999 (1980-12-01), Decker, Jr.
patent: 4427615 (1984-01-01), Eskesen
patent: 4746392 (1988-05-01), Hoppe
patent: 4961893 (1990-10-01), Rose
patent: 5030309 (1991-07-01), Brignet et al.

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