Method for forming solder balls on a substrate

Details Method for forming solder balls on a substrate Method for forming solder balls on a substrate

1995-10-31

1997-08-19

Niebling, John

Metal fusion bonding

Process

Plural joints

438615, 438125, 427 96, H01L 23488, H01L 23498, H01L 2350

Patent

active

056588275

ABSTRACT:
A method for forming solder ball contacts on a Ball Grid Array (BGA) is described. The solder balls are formed by squeegeeing solder paste through apertures in a fixture into contact with pads on a substrate, and heating the fixture, paste and substrate to reflow the solder paste into solder balls that attach to the pads and are detached from the fixture. After cooling, the fixture is readily separated from the substrate while leaving the solder balls in positive (conductive) contact with contact pads on the substrate.

REFERENCES:
patent: 3569607 (1971-03-01), Martyak
patent: 4412642 (1983-11-01), Fisher, Jr.
patent: 4655164 (1987-04-01), Nelson et al.
patent: 4914814 (1990-04-01), Behun et al.
patent: 5024372 (1991-06-01), Altman et al.
patent: 5039628 (1991-08-01), Carey
patent: 5211328 (1993-05-01), Ameen et al.
patent: 5268068 (1993-12-01), Cowell et al.
patent: 5372295 (1994-12-01), Abe et al.
patent: 5480835 (1996-01-01), Carney et al.
patent: 5536677 (1996-07-01), Hubacher
patent: 5539153 (1996-07-01), Schwiebert et al.

Affiliated with

Also associated with

Rating

Method for forming solder balls on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming solder balls on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming solder balls on a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1104480