Semiconductor casing

Details Semiconductor casing Semiconductor casing

Filed on

1982-07-15

Date issued

1984-10-30

Examiner

James, Andrew J.

Other Related Categories

357 81, 357 71, H01L 2152, H01L 2150, H01L 2340, H01L 2310

Type

Patent

Status

active

Patent number

044802625

Description

ABSTRACT:
A casing for an electrical component comprises a metal lead frame having the electrical component connected thereto. A metal base member is bonded to one surface of the lead frame. A plastic housing member is bonded to a second surface of the lead frame. An adhesive seals and bonds the metal base member and plastic housing member to the lead frame so as to enclose the electrical component.

REFERENCES:
patent: 3341369 (1967-09-01), Caule et al.
patent: 3676292 (1972-07-01), Pryor et al.
patent: 4079511 (1978-03-01), Grabbe
patent: 4107555 (1978-08-01), Haas et al.
patent: 4126758 (1978-11-01), Krumme
patent: 4266239 (1981-05-01), Miyagaki et al.
patent: 4278990 (1981-07-01), Fichot
patent: 4293768 (1981-10-01), Adachi et al.
patent: 4330790 (1982-05-01), Burns
Neighbour et al., "Factors Governing Aluminum Interconnection Corrosion in Plastic Encapsulated Microelectronic Devices", Microelectronics and Reliability, Pergamon Press, Great Britain, vol. 16, 1977, pp. 161-164.
Olberg et al., "Factors Contributing to the Corrosion of the Aluminum Metal on Semiconductor Devices Packaged in Plastics", Microelectronics and Reliability, Pergamon Press, Great Britain, vol. 15, 1976, pp. 601-611.

Affiliated with

Also associated with

Rating

Semiconductor casing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor casing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor casing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1104409