Method for underencapsulating components on circuit supporting s

Details Method for underencapsulating components on circuit supporting s Method for underencapsulating components on circuit supporting s

1993-07-06

1995-02-07

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 427 96, H05K 330

Patent

active

053866240

ABSTRACT:
A method and apparatus for underencapsulating a component (502) on a substrate (402). The method robotically places an underencapsulant film (406) on at least one surface of a first surface of the component (502) and a second surface of a substrate (402), the first and second surfaces substantially opposing each other when the component (502) is placed on the substrate (402). Next, the method places the component (502) on the substrate (402) to dispose the underencapsulant film (406) between the first and second surfaces. The method then bonds (1006,1008 or 1006,1010) the component (502) to the substrate (402) with the underencapsulant (406).

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