Low temperature flexible die attach adhesive and articles using

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof

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Details

252512, 252514, 523400, 523416, 528363, 528422, C08G 6344

Patent

active

053860004

ABSTRACT:
Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.

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