Multi-chip module

Details Multi-chip module Multi-chip module

1993-05-21

1994-11-15

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361738, 361760, 361761, 174255, H05K 116

Patent

active

053654056

ABSTRACT:
A multi-chip module has a carrier (21) of monocrystalline silicon whose surface is at least partially enlarged by anodic electro-chemical etching in a fluoride-containing acidic electrolyte. At least one capacitor (23) that has a dielectric layer and a conductive layer is arranged on the enlarged surface of the carrier (21), whereby the carrier (21) and the conductive layer act as capacitor electrodes.

REFERENCES:
patent: 4947286 (1990-08-01), Kaneko
patent: 5018051 (1991-05-01), Yamada

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