Heat sinking apparatus for surface mountable power devices

Details Heat sinking apparatus for surface mountable power devices Heat sinking apparatus for surface mountable power devices

1992-08-03

1994-11-15

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165185, 174 163, 257712, 361702, H05K 720

Patent

active

053653998

ABSTRACT:
A heat sinking apparatus that dissipates heat generated by a surface mountable power device, which can be auto picked and placed, comprises a first planar surface, at least one gull wing mounting tab, and at least one connective leg. The at least one connective leg thermally couples the first planar surface to the gull wing tab and all three structures are comprised of a thermally conductive material. When the heat sinking apparatus is coupled to a substrate, heat generated by the surface mountable power device is thermally transferred through a thermal plane of the substrate to the heat sinking apparatus.

REFERENCES:
patent: 3786317 (1974-01-01), Thierfelder
patent: 3972062 (1976-07-01), Hopp
patent: 4147889 (1979-04-01), Andrews et al.
patent: 4504886 (1985-03-01), Cygan et al.
patent: 4945451 (1990-07-01), Gohl et al.
patent: 4970579 (1990-11-01), Arldt et al.
patent: 5031028 (1991-07-01), Galich et al.
Research Disclosure, Jan. 1991, No. 321, Kenneth Mason Publications Ltd, England, p. 1, entitled "Soft-Metal Interfaced Heatsinks For Air-Cooled Electronics Packager".

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