Thermally conductive printed wiring board laminate

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428901, 428408, 428418, 428245, H05K 104, B05D 512

Patent

active

046095861

ABSTRACT:
A printed wiring board laminate is disclosed that is particularly suitable for use with leadless surface mounted devices such as ceramic chip carries. The laminate combines a low coefficient of thermal expansion in the X-Y direction with thermal conductivity. In one embodiment, the laminate comprises a support fabricated from graphite fiber reinforced metal adhesively secured to a printed wiring board fabricated from dielectric (e.g., glass) fiber reinforced resin. The support has an X-Y coefficient of thermal expansion less than about 4 ppm/.degree.C., and the printed wiring board has a coefficient of thermal expansion greater than about 10 ppm/.degree.C. In a second embodiment, the support comprises a core of graphite fiber reinforced metal or resin sandwiched between two metal sheets.

REFERENCES:
patent: Re29784 (1978-09-01), Chadwick et al.
patent: 3107197 (1963-10-01), Stein et al.
patent: 3136680 (1964-06-01), Hochberg
patent: 3166688 (1965-01-01), Rowand et al.
patent: 3168426 (1965-02-01), Blackie
patent: 3217083 (1965-11-01), Gore
patent: 3398233 (1968-08-01), Lizasoain et al.
patent: 3421972 (1969-01-01), Cromwell et al.
patent: 3486961 (1969-12-01), Adams
patent: 3700538 (1972-10-01), Kennedy
patent: 3770488 (1973-11-01), Pepper et al.
patent: 3864160 (1975-02-01), Davidoff
patent: 3894863 (1975-07-01), Lachman et al.
patent: 3934334 (1976-01-01), Hanni
patent: 3972755 (1976-08-01), Misfeldt
patent: 3972765 (1976-08-01), Kondo et al.
patent: 4018962 (1977-04-01), Pedlow
patent: 4035694 (1977-07-01), Barton et al.
patent: 4103102 (1978-07-01), Klein
patent: 4132828 (1979-01-01), Nakamura et al.
patent: 4157409 (1979-06-01), Levitt et al.
patent: 4169911 (1979-10-01), Yoshida et al.
patent: 4254172 (1981-03-01), Takahashi et al.
patent: 4303715 (1981-12-01), Chang
patent: 4318954 (1982-03-01), Jensen
patent: 4335180 (1982-06-01), Traut
patent: 4410585 (1983-10-01), McLoughlin
patent: 4507341 (1985-03-01), Heseltine
"Using Hermetic Chip Carriers in Military Applications, Part 1: Some Useful Modules", P. F. McKittrick, Circuits Manufacturing, May 1984, pp. 48-54.
"Kevlar.RTM. Epoxy for Chip Carrier MLBs", Rodman A. Mogle & Douglas J. Sober, pp. 1-9.
"Section 2 Task I-Materials Development", Lockheed Missiles & Space Co., Inc., LMSC-D758140, pp. 2-1 thru 3-42.
"Kevlar.RTM. Epoxy Substrate for Interconnecting Leadless Chip Carrier", Packard, 15th National SAMPE Technical Conference, Oct. 4-6, 1983, pp. 636-645.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermally conductive printed wiring board laminate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally conductive printed wiring board laminate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally conductive printed wiring board laminate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1097275

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.