Method of transferring conductive balls

Metal working – Method of mechanical manufacture – Assembling or joining

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Details

29743, 228 41, 228245, B23P 1100, B23K 3512

Patent

active

056575289

ABSTRACT:
A suction head is introduced into a ball reservoir holding conductive balls, such as solder balls, and a plurality of suction holes formed in a suction surface of the suction head, hold the conductive balls by suction, respectively. Then, the suction head is moved into a position above a workpiece placed in position, and the suction is released from the conductive balls held on the suction head, thereby placing these conductive balls onto the workpiece. The suction head is vibrated or moved within the ball reservoir so that each of the suction holes can positively hold one conductive ball, thus preventing extra conductive balls from sticking to the suction head.

REFERENCES:
patent: 4480780 (1984-11-01), Claeskens et al.
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 5445313 (1995-08-01), Boyd et al.
patent: 5467913 (1995-11-01), Namekawa et al.

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