Method of burnishing malleable films on semiconductor substrates

Details Method of burnishing malleable films on semiconductor substrates Method of burnishing malleable films on semiconductor substrates

1984-05-14

1986-09-02

Schmidt, Frederick R.

Metal fusion bonding

Process

With shaping

29 90R, B21D 3900

Patent

active

046091394

ABSTRACT:
An improved burnishing method suitable for planarizing bonding pads on fragile semiconductor devices is disclosed. The method comprises imparting scratches of predetermined depth and spacing onto a glass slide. The bonding pad surface is contacted to the scratched glass surface under a desired pressure and a relative motion is established therebetween. The motion is continued until a smooth, defect-free bonding pad surface has been provided.

REFERENCES:
patent: 3613107 (1971-10-01), Cavagnero
patent: 3676214 (1972-07-01), English et al.
patent: 3883946 (1975-05-01), Dale
patent: 3946334 (1976-03-01), Yonezu et al.
patent: 4179852 (1979-05-01), Barnett
patent: 4347486 (1982-08-01), Botez

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