Thermocompression bonding of copper leads to a metallized cerami

Details Thermocompression bonding of copper leads to a metallized cerami Thermocompression bonding of copper leads to a metallized cerami

1986-10-27

1988-03-29

Ramsey, Kenneth J.

Metal fusion bonding

Process

Critical work component, temperature, or pressure

228203, 2281802, 357 80, H01L 2350

Patent

active

047347538

ABSTRACT:
Copper leads having an average grain size from 0.035 to 0.055 mm are thermocompression bonded to a metallized portion of a ceramic substrate. Surprisingly, such large grain size substantially decreases the "ceramic pullout" of the bonded leads.

REFERENCES:
patent: 4016050 (1977-04-01), Lesh et al.
patent: 4069916 (1978-01-01), Fowler et al.
patent: 4234666 (1980-11-01), Gursky
patent: 4563811 (1986-01-01), Cranston
Metals Handbook, vol. 2, Ninth Edition, 1979, p. 241.
Rogers, "How Fairchild Makes Its New Face-Down Bonded Microcircuits", Insulation, Nov. 1967, pp. 48-51.
Understanding Copper Alloys, The Manufacture and Use of Copper, Copper Alloy Sheet and Strip, edited by J. Mendenhall (Olin Corporation), 1977, pp. 26-29 and 68-85.

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