Method of growing a resistive epitaxial layer on a short lifetim

Metal treatment – Compositions – Heat treating

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148175, 148187, 29571, 29576B, H01L 2120, H01L 21225, H01L 21265

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045796017

ABSTRACT:
A method for manufacturing a semiconductor device has the steps of: forming a first thin single-crystal semiconductor layer on a semiconductor substrate of one conductivity type which contains oxygen, the first thin single-crystal semiconductor layer having a higher resistivity than that of the semiconductor substrate and having the same conductivity type as that of the semiconductor substrate; ion-implanting an electrically inactive impurity in the first thin single-crystal semiconductor layer; forming a second thin single-crystal semiconductor layer on the first thin single-crystal semiconductor layer, the second thin single-crystal semiconductor layer having the same conductivity type as that of the semiconductor substrate and having a higher resistivity than that of the semiconductor substrate; performing annealing for not less than four hours at a temperature of 550.degree. C. to 900.degree. C. after the electrically inactive impurity is ion-implanted; and forming a cell of a dynamic random access memory in the second thin single-crystal semiconductor layer, the cell having one transistor and one capacitor.

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