Performance prediction method for semiconductor power modules an

Details Performance prediction method for semiconductor power modules an Performance prediction method for semiconductor power modules an

1994-10-31

1997-08-05

Teska, Kevin J.

Boots, shoes, and leggings

36455101, 340511, 371 251, 324765, H01L 2978, G06F 1100

Patent

active

056548966

ABSTRACT:
Apparatus (30) and method (70) for predicting the future performance of a semiconductor power module, power device, or high power integrated circuit for the purpose of planning its repair or replacement before it actually fails. The apparatus provides a central processor (33), output device (37), user interface (39), system memory (35), and data base (41). The method is provided by an application specific integrated circuit (45) or custom software program (45). The method provides a measurement and testing procedure for device parameters such as thermal resistance R.sub.thJC, power supply voltage V.sub.DD, and power supply current I.sub.DD. These device parameters typically characterize various chip components including the die attached interface, chip structure, and bonding wires. As these components degrade, the method via monitoring device parameters turns-off the device and its peripheral circuits and apparatus in an orderly manner.

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