High frequency module and method of producing the same

Details High frequency module and method of producing the same High frequency module and method of producing the same

1994-03-25

1995-10-03

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29835, 29841, 257698, H01L 2328

Patent

active

054553849

ABSTRACT:
A method of producing a high frequency module comprises the steps of connecting leads to a circuit board, covering the circuit board with an insulating member such that the leads protrude from the insulating member, cutting off portions of the leads protruding from the insulating member having been molded, forming a metal film on the entire periphery of the insulating member, and removing the metal film around the leads to thereby form electrodes which are separate from the other portions of the metal film. The metal film is formed by evaporation, spraying or plating while the portions of the metal film around the leads are removed by chemical etching or machining. Further, the leads are connected to the circuit board on the same surface as electronic parts. The circuit board is covered with the insulating member in a rectangular parallelepiped configuration. The electrodes individually extend from the sides where the leads are present to the surface contiguous with the sides.

REFERENCES:
patent: 5030800 (1991-07-01), Kawakami et al.
patent: 5032803 (1991-07-01), Koch
patent: 5043848 (1991-08-01), Rogers et al.
patent: 5177324 (1993-01-01), Carr et al.
patent: 5294897 (1994-03-01), Notani et al.

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