Methods for making high performance lateral bipolar transistors

Details Methods for making high performance lateral bipolar transistors Methods for making high performance lateral bipolar transistors

1983-08-04

1985-01-08

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29578, 29576W, 148 15, 148175, 148186, 357 35, 357 49, 357 55, H01L 2708, H01L 2176

Patent

active

044920083

ABSTRACT:
A high performance lateral transistor may be fabricated by first providing a monocrystalline semiconductor body having a principal surface and where the desired transistor is a PNP transistor, a buried N+ region with an N+ reach-through connecting the buried region to said principal surface. The collector region of the transistor is formed into the surface by blanket diffusing P type impurities into the desired region. An insulating layer is formed upon the top surface of the semiconductor body. An opening is made in the insulating layer where the groove or channel-emitter contact is desired. An etching of a substantially vertical walled groove into the monocrystalline semiconductor body using the patterned insulating layer as the etching mask. An N base diffusion is carried out to produce as N region around the periphery of the opening in the body. Oxygen is then ion implanted into the bottom of the groove to form a silicon dioxide region at the bottom of the groove. The P+ polycrystalline silicon layer is then formed on the surface which will in turn fill the groove with this material. The heating of the structure forms the P+ emitter region around the side edges of the P+ polycrystalline silicon filled groove. The P+ polycrystalline layer is the emitter contact, the N+ reach-through connected through the buried N+ region is the base contact and the collector contact is made to the P-type collector region.

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