Method of making a chip carrier slotted array

Metal working – Method of mechanical manufacture – Electrical device making

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29850, 156252, 156257, 357 80, H01L 2348, H05K 310

Patent

active

048022772

ABSTRACT:
A method of making a chip carrier array including the steps of providing a ceramic substrate and forming elongated slots in the substrate which define the edges thereof and which form one severable interconnecting bridge at each edge of each chip carrier, which bridges maintain the individual chip carriers in the array. A plurality of edge interconnect conductors are formed along each edge portion of each chip carrier on either side of the interconnecting bridges.

REFERENCES:
patent: 3924746 (1975-12-01), Haines
patent: 3926746 (1975-12-01), Hargis
patent: 3941248 (1976-11-01), Moser et al.
patent: 4357192 (1982-11-01), Moser
patent: 4398634 (1983-08-01), McClosky
patent: 4577757 (1986-02-01), Spadafora
patent: 4681656 (1987-07-01), Byrum
patent: 4700473 (1987-10-01), Freyman et al.

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