Leadframe finger support

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Patent

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Details

257669, 257735, 438123, H01L 23495, H01L 2348, H01L 2352, H01L 2940

Patent

active

061216739

ABSTRACT:
A leadframe includes a leadframe finger support for supporting elongate leadframe fingers. These elongate leadframe fingers are subject to damage prior to or during the assembly process. Through the provision of the leadframe finger support, the leadframe fingers may be supported at an intermediate position along their length as necessary to prevent bending. The support may be severed from the dam bar in the course of singulation.

REFERENCES:
patent: 4868635 (1989-09-01), Frechette et al.
patent: 5648681 (1997-07-01), Takashima et al.
patent: 5883424 (1999-03-01), Tanaka

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