Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-08-14
1997-08-05
Picardat, Kevin
Metal working
Method of mechanical manufacture
Electrical device making
438126, 29841, H01L 2160
Patent
active
056542437
ABSTRACT:
A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip therein, a thermally conductive frame member having a flange part supporting the substrate of a rim part of the substrate, wherein the thermal conductive frame member has a thermal conductivity substantially larger than that of the resin package body and extending along to and in an intimate contact with side walls of the resin package body.
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Tsuji Kazuto
Yoneda Yoshiyuki
Fujitsu Limited
Picardat Kevin
LandOfFree
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