Semiconductor mold having cavity blocks with cavities on top and

Details Semiconductor mold having cavity blocks with cavities on top and Semiconductor mold having cavity blocks with cavities on top and

1992-12-21

1995-10-03

Woo, Jay H.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

26427217, 4251291, 425183, 425190, 425544, B29C 4510, B29C 4514

Patent

active

054547059

ABSTRACT:
A metallic mold for molding semiconductor package including a pair of cavity blocks capable of molding two types of semi conductor packages in order to reduce manufacturing cost. The metallic mold includes an upper cavity block to be inserted in its normal state and its turned over state in an upper chase block mounted on a lower surface of a top mold base of an upper mold die which is formed at its upper surface with one type of cavities and at its lower surface with another type of cavities, and a lower cavity block to be inserted in its normal state and its turned over state in a lower chase bock mounted on a bottom mold base of a lower mold base which is formed at its upper surface with cavities mating with the another type of cavities of the upper cavity block and at its lower surface with cavities mating with the one type of cavities of the upper cavity block.

REFERENCES:
patent: 1317093 (1919-09-01), Minnick
patent: 1409591 (1922-03-01), Schavoir
patent: 2663905 (1953-12-01), Van Riper et al.
patent: 3871611 (1975-03-01), Takata
patent: 4158910 (1979-06-01), Hanas et al.
patent: 4345965 (1982-08-01), Lindenmayer et al.
patent: 4374080 (1983-02-01), Schroeder
patent: 4551084 (1985-11-01), Lake
patent: 4793785 (1988-12-01), Osada
patent: 5061164 (1991-10-01), Sabado et al.

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