Hermetic sealing of wafer scale integrated wafer

Details Hermetic sealing of wafer scale integrated wafer Hermetic sealing of wafer scale integrated wafer

1989-07-17

1992-09-22

James, Andrew J.

357 75, 357 80, H01L 2332

Patent

active

051501961

ABSTRACT:
A hermetically sealed integrated wafer wherein the integrated wafer is sandwiched between a support layer and expansion buffering layer. The expansion buffering layer includes a centrally-located opening through which integrated circuits located on the wafer may extend. A sealing ring and cover plate are bonded to the expansion buffering layer to provide hermetic sealing of integrated circuits or other electronic elements located on the wafer.

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patent: 4701424 (1987-10-01), Mikkor
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patent: 4709468 (1987-12-01), Wilson
patent: 4802062 (1989-01-01), Blum et al.
patent: 4825282 (1989-04-01), Fukaya
patent: 4837184 (1989-06-01), Lin et al.
patent: 4905075 (1990-02-01), Temple et al.

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