Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1990-03-16
1991-10-22
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
4273741, C23C 2600
Patent
active
050594508
ABSTRACT:
The process comprises, after deposition of a layer of raw ink on a support having a high thermal dissipation, of the aluminium nitride type, effecting a preliminary drying of this ink at a temperature on the order of 100.degree. C. to 150.degree. C., then a firing comprising:
REFERENCES:
patent: 4388347 (1983-06-01), Shum
patent: 4540604 (1985-09-01), Siuta
patent: 4622240 (1986-11-01), Yext
patent: 4627160 (1986-12-01), Herron
IEEE Transaction on Components, Hybrids, and Manufacturing Tech., vol. ChMT-8, No. 2, Jun. 1985, pp. 253-258, IEEE, N.Y., U.S.; N. Iwase et al.: "Thick film and direct bond copper forming technologies for aluminum nitride substrate".
29th Electronic Components Conference, Cherry Hill, NJ, 14-16 May 1979, pp. 1-10, IEE, N.Y., U.S.; J. D. Mitchell et al.: "Processing Techniques for Fabricating Thick Film Copper/Dielectric Multilayer Structures".
Proceedings of the Electronic Components Conference, Seattle, 1986, pp. 471-480, IEEE, N.Y., U.S; R. J. Bacher et al.: "Firing process-related failure mechanisms in thick film copper multilayers".
Mellul Sylvie
Navarro Dominique
Rotman Frederic
Beck Shrive
Dang Vi Duong
L'Air Liquide
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