Lightweight thermally responsive mold for resin transfer molding

Details Lightweight thermally responsive mold for resin transfer molding Lightweight thermally responsive mold for resin transfer molding

1996-02-15

1997-08-05

Woo, Jay H.

Static molds

Including means within surface to confine heat exchange medium

249 80, 249116, 249135, 425544, 425547, 264236, 264328005, 264328014, B29C 3342

Patent

active

056539070

ABSTRACT:
A lightweight thermally responsive mold for use with a resin transfer molding process is provided. The mold includes first and second support frames including a plurality of upstanding intersecting support ribs. First and second substrates are supported by the first and second support frames, respectively, for carrying heating tubes therein. First and second hard shells are supported by the first and second substrates, respectively. The shells cooperate to form a mold cavity therebetween. Each shell is less than approximately 10 mm thick in order to provide a low thermal mass and high thermal responsiveness.

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