Method for removing accumulated solder from probe card probing f

Semiconductor device manufacturing: process – Repair or restoration

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438 14, 134 2, 134 3, 134 6, 134 41, H01L 2100

Patent

active

061210587

ABSTRACT:
A method for removing deposits from a probing feature of a probe card. The method includes the step of exposing the probing feature of a probe card to a composition that chemically reacts with the deposits on the probing feature to remove the deposits from the probing feature while not substantially effecting the material comprising the probing feature.

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patent: 5802714 (1998-09-01), Kobayashi et al.
patent: 5814158 (1998-09-01), Hollander et al.

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