Polishing apparatus with swinging structures

Details Polishing apparatus with swinging structures Polishing apparatus with swinging structures

1995-09-13

1997-08-05

Rose, Robert A.

Abrading

Machine

Rotary tool

451285, 451286, 451288, 451289, 451290, 451 41, B24B 500, B24B 2900

Patent

active

056536240

ABSTRACT:
A compact polishing apparatus requires less operating space than a conventional polishing apparatus generally used for polishing semiconductor wafers. The present apparatus has a swing shaft to provide a swing motion to a pressing device including a top ring member. There are three ranges of swing motion, i.e. a polishing range which is a small motion range used for polishing a wafer within the confined area of a turntable, a receiving range which is a medium motion range used for loading/unloading of a wafer in an area beyond the turntable, and a standby range which is a large motion range used for moving the top ring member to a standby or rinsing position in an area beyond the turntable. Because of the swing-based arrangement of the components in the present apparatus, isolation of critical components is easily achieved, thus resulting in low maintenance costs and long service life of the present apparatus. These advantages offer significant cost savings in the management of polishing operations.

REFERENCES:
patent: 3857123 (1974-12-01), Walsh
patent: 3863395 (1975-02-01), Brown
patent: 4141180 (1979-02-01), Gill, Jr. et al.
patent: 4669223 (1987-06-01), Schwar
patent: 5317837 (1994-06-01), Stahli
patent: 5333413 (1994-08-01), Hashimoto
patent: 5361545 (1994-11-01), Nakamura
patent: 5435772 (1995-07-01), Yu
patent: 5476414 (1995-12-01), Hirose et al.
patent: 5486131 (1996-01-01), Cesna et al.

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