Die thinning apparatus

Details Die thinning apparatus Die thinning apparatus

1998-02-17

2000-01-04

Hail, III, Joseph J.

Abrading

Abrading process

Glass or stone abrading

451386, 451398, 451402, 451441, B24B 4106

Patent

active

060103922

ABSTRACT:
A fixture for holding a semiconductor die against an abrasive media for the purpose of thinning the die is described. The fixture provides means for aligning the back of the die to a reference plane that is coplanar with the plane of the abrasive and is in contact with the abrasive media during the thinning process.

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IBM Technical Disclosure Bulletin, vol. 31, No. 04, Sep., 1988, "Multi-Prupose Lapping/Polishing Fixture for Microanalysis".

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