Embedded electroconductive layer and method for formation thereo

Details Embedded electroconductive layer and method for formation thereo Embedded electroconductive layer and method for formation thereo

1996-06-07

1998-04-07

Raimund, Christopher

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427123, 427299, 427252, 427253, 437190, 437192, 437194, 437200, 437203, B05D 512

Patent

active

057361924

ABSTRACT:
An embedded electroconductive layer is disclosed which comprises an opening part or a depressed part 3 formed in an insulating film 2 on a substrate 1, a barrier layer for covering the opening part or the depressed part, a metal growth promoting layer 5 on the barrier layer, and an electroconductive layer 6 embedded in the opening part or the depressed part via the barrier layer 4 and the metal growth promoting layer 5.

REFERENCES:
patent: 4990997 (1991-02-01), Nishida
patent: 5070036 (1991-12-01), Stevens
John A.T. Norman, David A. Roberts et al., Enhanced Deposition of Copper Films by CVD -Advanced Metalization for ULSI Application pp. 57-62 (Jan. 1994).
Susan L. Cohen, Michael Liehr and Srinandan Kasi, Mechanisms of copper chemical vapor depositions, Appl. Phys. Lett. 60 (1), Jan. 6, 1992, pp. 50-52.

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