Method for multilayer thin film deposition

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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204192P, C23C 1500

Patent

active

042984440

ABSTRACT:
Apparatus for sputter depositing two or more layers of material onto a substrate in one operation includes an evacuable chamber containing a transport mechanism, substrate support, and at least two deposition units situated proximate the support. The transport mechanism moves the substrate to and from the support. When at the support, the substrate is passed by one deposition unit and then the other for sputter deposition of a thin film of material by each unit.

REFERENCES:
patent: 2734478 (1956-02-01), Reynolds et al.
patent: 3793167 (1974-02-01), Glaser
patent: 3838028 (1974-09-01), Needham et al.
patent: 3945903 (1976-03-01), Svendor et al.
patent: 3976555 (1976-08-01), Von Hartel
patent: 4132624 (1979-01-01), King et al.
patent: 4151064 (1979-04-01), Kuehule
Maissel O. Glang, "Handbook of Thin Film Technology", McGraw-Hill, 1970, pp. 1-80 to 1-91.
W. D. Holt, "The Case for Air-to-Air In-Line Systems".

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