Metal-film laminate resistant to delamination

Stock material or miscellaneous articles – All metal or with adjacent metals – Microscopic interfacial wave or roughness

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428623, 428626, 428675, B32B 310

Patent

active

060601752

ABSTRACT:
A flexible metal-film laminate can comprise a layered film structure having a metal layer securely bonded to a film layer. The laminate contains a unique metal-oxide attachment structure between the film and metal layer comprising randomly distributed regions of metal-oxide. After the metal/metal-oxide layer, a chromium metal or chromium alloy layer is formed before subsequent layers of copper, gold, etc. The peel strength of such a laminate is significantly improved over prior laminates and is resistant to peel strength reduction due to environmental stress. The preferred metal-film laminates made with polyester or polyimide can be used in the manufacture of high-quality, low cost, flexible printed circuit boards.

REFERENCES:
patent: 3149021 (1964-09-01), Goepfert et al.
patent: 3477900 (1969-11-01), Soukup et al.
patent: 3700538 (1972-10-01), Kennedy
patent: 3981691 (1976-09-01), Cuneo
patent: 4081578 (1978-03-01), Van Essen et al.
patent: 4093768 (1978-06-01), Cordts et al.
patent: 4153518 (1979-05-01), Holmes et al.
patent: 4189517 (1980-02-01), Shanoski et al.
patent: 4193849 (1980-03-01), Sato
patent: 4395313 (1983-07-01), Lindsay et al.
patent: 4402998 (1983-09-01), Kumagai et al.
patent: 4414173 (1983-11-01), Cobbledick et al.
patent: 4420509 (1983-12-01), Barrell et al.
patent: 4444848 (1984-04-01), Shanefield et al.
patent: 4463060 (1984-07-01), Updegraff
patent: 4482998 (1984-11-01), Marouf et al.
patent: 4524089 (1985-06-01), Hague et al.
patent: 4568413 (1986-02-01), Toth et al.
patent: 4582564 (1986-04-01), Shanefield et al.
patent: 4597828 (1986-07-01), Tadros
patent: 4720401 (1988-01-01), Ho et al.
patent: 4724401 (1988-02-01), Hogge, Jr. et al.
patent: 4772488 (1988-09-01), Pinch et al.
patent: 4835061 (1989-05-01), Ohta et al.
patent: 4863808 (1989-09-01), Sallo
patent: 4886681 (1989-12-01), Clabes et al.
patent: 4913938 (1990-04-01), Kawakami et al.
patent: 4916016 (1990-04-01), Bristowe et al.
patent: 5015538 (1991-05-01), Krause et al.
patent: 5364707 (1994-11-01), Swisher
patent: 5389446 (1995-02-01), Yamanishi et al.
patent: 5527998 (1996-06-01), Anderson et al.
Handbook of Wiring, Cabling, and Internconnecting for Electronics, Jan. 9, 1973, pp. 8-10, 8-20, 8-21, 8-22, 8-26.
V. Fronz and R. Mueller, "Plasma Pretreatment of Polyimide Films", Renker GmbH & Co. KG. Hausener Weg 1, 7800 Frieburg, Apr., 1989.
Kirk-Othmer Encyclopedia of Chemical Technology, vol. 9, pp. 186-220, 1966.
Encyclopedia of Chemical Technology, Abridged Version of the 24 Vol., 3rd Ed., New York Wiliey, Copyright 1978-1984, pp. 476-478.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Metal-film laminate resistant to delamination does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal-film laminate resistant to delamination, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal-film laminate resistant to delamination will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1062942

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.